LED燈具中英文常用辭匯對(duì)照表之PCB相關(guān)術(shù)語(yǔ)
旭高LED照明為各位關(guān)心LED產(chǎn)業(yè)的人士整理了LED中英文常用辭匯對(duì)照表,首先推出的是PCB相關(guān)術(shù)語(yǔ)的中英對(duì)照。
以下是常用的相關(guān)術(shù)語(yǔ)表:
板 board
母板 mother board
子板 daughter board
背板 backplane
裸板 bare board
印制電路 printed circuit
印制線路 printed wiring
印制板 printed board
印制板電路 printed circuit board
印制線路板 printed wiring board
印制元件 printed component
印制接點(diǎn) printed contact
印制板裝配 printed board assembly
剛性印制板 rigid printed board
撓性印制電路 flexible printed circuit
撓性印制線路 flexible printed wiring
齊平印制板 flush printed board
金屬芯印制板 metal core printed board
金屬基印制板 metal base printed board
多重?線印制板 mulit-wiring printed board
模塑電路板 molded circuit board
散線印制板 discrete wiring board
微線印制板 micro wire board
積層印制板 buile-up printed board
表面層合電路板 surface laminar circuit
埋入凸塊連印制板 B2it printed board
載芯片板 chip on board
埋電阻板 buried resistance board
鍵盤板夾心板 copper-invar-copper board
動(dòng)態(tài)撓性板 dynamic flex board
靜態(tài)撓性板 static flex board
可斷拼板 break-away planel
電纜 cable
撓性扁平電纜 flexible flat cable (FFC)
薄膜開關(guān) membrane switch
混合電路 hybrid circuit
厚膜 thick film
厚膜電路 thick film circuit
薄膜 thin film
薄膜混合電路 thin film hybrid circuit
互連 interconnection
導(dǎo)線 conductor trace line
齊平導(dǎo)線 flush conductor
傳輸線 transmission line
跨交 crossover
板邊插頭 edge-board contact
導(dǎo)電圖形 conductive pattern
非導(dǎo)電圖形 non-conductive pattern
字元legend
標(biāo)? mark
基材base material
層壓板 laminate
覆金屬箔基材 metal-clad bade material
覆銅箔層壓板 copper-clad laminate (CCL)
復(fù)合層壓板 composite laminate
薄層壓板 thin laminate
基體材料 basis material
預(yù)浸材料 prepreg
粘結(jié)片 bonding sheet
預(yù)浸粘結(jié)片 preimpregnated bonding sheer
環(huán)氧玻璃基板 epoxy glass substrate
預(yù)制內(nèi)層覆箔板 mass lamination panel
基底 substrate
基板面 real estate
導(dǎo)線面 conductor side
元件面 component side
焊接面 solder side
印制 printing
網(wǎng)格 grid
圖形 pattern
內(nèi)層芯板 core material
粘結(jié)層 bonding layer
粘結(jié)膜 film adhesive
無(wú)支撐膠粘劑膜 unsupported adhesive film
覆蓋層 cover layer (cover lay)
增強(qiáng)板材 stiffener material
銅箔面 copper-clad surface
去銅箔面 foil removal surface
層壓板面 unclad laminate surface
基膜面 base film surface
膠粘劑面 adhesive faec
超薄型層壓板 ultra thin laminate
結(jié)晶現(xiàn)象crystalline polamer
雙晶現(xiàn)象dimorphism
共聚物 copolymer
環(huán)氧值 epoxy value
雙氰胺 dicyandiamide
粘結(jié)劑 binder
膠粘劑 adesive
固化劑 curing agent
阻燃劑 flame retardant
遮光劑 opaquer
增塑劑 plasticizers
氟樹脂 fluroresin
硅樹脂 silicone resin
階樹脂 A-stage resin A
階樹脂 B-stage resin B
階樹脂 C-stage resin C
環(huán)氧樹脂 epoxy resin
酚醛樹脂 phenolic resin
聚酯樹脂 polyester resin
聚醯亞胺樹脂 polyimide resin
合成樹脂 synthetic
熱固性樹脂 thermosetting resin
熱塑性樹脂 thermoplastic resin
感光性樹脂 photosensitive resin
雙馬來(lái)醯亞胺三嗪樹脂 bismaleimide-triazine resin
丙烯酸樹脂 acrylic resin
三聚氰胺甲醛樹脂 melamine formaldehyde resin
多官能環(huán)氧樹脂 polyfunctional epoxy resin
溴化環(huán)氧樹脂 brominated epoxy resin
環(huán)氧酚醛 epoxy novolac
硅烷 silane
不飽和聚酯 unsatuiated polyester
導(dǎo)電箔 conductive foil
銅箔 copper foil
壓延銅箔rolled copper foil
退火銅箔annealed copper foil
薄銅箔 thin copper foil
涂膠銅箔adhesive coated foil
涂膠脂銅箔 resin coated copper foil
復(fù)合金屬箔composite metallic material
聚酯薄膜 polyester
聚醯亞胺薄膜 polyimide film (PI)
玻璃纖維 glass fiber
玻璃纖維E-glass fibre E
玻璃纖維D-glass fibre D
玻璃纖維S-glass fibre S
玻璃布glass fabric
非織布 non-woven fabric
玻璃纖維墊 glass mats
白度 whitenness
陶瓷 ceramics
印制線路?設(shè) printed wire layout
?設(shè)總圖 master drawing
電腦輔助制圖 computer aided drawing
裝配圖 assembly drawing
電腦控制顯示computer controlled display
?局 placement
?線 routing
布圖設(shè)計(jì) layout
重布 rerouting
圖形顯示 graphics dispaly
比例因數(shù) scaling factor
掃描填充 scan filling
矩形填充 rectangle filling
填充域 region filling
實(shí)體設(shè)計(jì) physical design
邏輯設(shè)計(jì) logic design
邏輯電路 logic circuit
元件密度 component density
導(dǎo)線(通道) conduction (track)
導(dǎo)線(體)寬度 conductor width
導(dǎo)線距離 conductor spacing
導(dǎo)線層 conductor layer
導(dǎo)線寬度/間距conductor line/space
第一導(dǎo)線層conductor layer No.1
分線separated time
分層eparated layer
孔環(huán) annular ring
元件孔 component hole
安裝孔mounting hole
支撐孔 supported hole
非支撐孔 unsupported hole
導(dǎo)通孔 via
鍍通孔 plated through hole (PTH)
余隙孔 access hole
盲孔 blind via (hole)
埋孔 buried via hole
埋,盲孔 buried blind via
任意層內(nèi)部導(dǎo)通孔 any layer inner via hole
全部鉆孔 all drilled hole
定位孔 toaling hole
中間孔 interstitial hole
無(wú)連接盤導(dǎo)通孔 landless via hole
引導(dǎo)孔 pilot hole
端接全隙孔 terminal clearomee hole
準(zhǔn)尺寸孔 dimensioned hole
在連接盤中導(dǎo)通孔 via-in-pad
孔位 hole location
孔密度 hole density
孔圖 hole pattern
鉆孔圖 drill drawing
定順序 definite sequence
圓形盤 round pad
方形盤 square pad
菱形盤 diamond pad
長(zhǎng)方形焊盤 oblong pad
子彈形盤 bullet pad
淚滴盤 teardrop pad
雪人盤 snowman pad
V形盤 V-shaped pad
環(huán)形盤 annular pad
非圓形盤 non-circular pad
隔離盤 isolation pad
非功能連接盤 monfunctional pad
偏置連接盤 offset land